Solutions for Communication and Electronics Industry

With the continuous advancement of radar technology, power amplifier modules in solid-state transmitters feature high assembly density and substantial heat generation, leading to rising heat flux density. Conventional forced air cooling can no longer meet the heat dissipation requirements. Liquid cooling cold plates stand out with high heat dissipation efficiency, low temperature gradient, uniform heat distribution and compact structure, and have become a mainstream cooling solution for solid-state power amplifier modules.

A liquid cooling cold plate is fabricated with serpentine cooling channels arranged inside the module housing. To ensure optimal heat dissipation, the cooling fluid is designed to flow directly beneath or around power transistors. Such cooling channels feature complex structures and are generally formed by welding to create a sealed flow path between the housing and cover plate. As a core component of radar transmitters, solid-state power amplifier modules are highly sensitive to leakage risks at weld seams, which would severely compromise the reliability of transmitters. Therefore, the welding process for liquid cooling channels is one of the key and challenging technologies in the development of power amplifier modules.